The global electronics manufacturing sector is increasingly reliant on high-density packaging solutions to support the "intelligence-first" era of computing. The Ball Grid Array (BGA) Microcontroller Socket Market represents a critical niche, enabling the non-permanent mounting of BGA microcontrollers for testing, prototyping, and modular hardware updates. Unlike permanent soldering, ... https://logcla.com/blogs/943268/Cloud-Based-GIS-Solutions-Market-Outlook-2025-2032